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PIC18FXX2
DS39564C-page 4
2006 Microchip Technology Inc.
Table of Contents
1.0
Device Overview .......................................................................................................................................................................... 7
2.0
Oscillator Configurations ............................................................................................................................................................ 17
3.0
Reset .......................................................................................................................................................................................... 25
4.0
Memory Organization ................................................................................................................................................................. 35
5.0
FLASH Program Memory ........................................................................................................................................................... 55
6.0
Data EEPROM Memory ............................................................................................................................................................. 65
7.0
8 X 8 Hardware Multiplier ........................................................................................................................................................... 71
8.0
Interrupts .................................................................................................................................................................................... 73
9.0
I/O Ports ..................................................................................................................................................................................... 87
10.0 Timer0 Module ......................................................................................................................................................................... 103
11.0 Timer1 Module ......................................................................................................................................................................... 107
12.0 Timer2 Module ......................................................................................................................................................................... 111
13.0 Timer3 Module ......................................................................................................................................................................... 113
14.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 117
15.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 125
16.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (USART).............................................................. 165
17.0 Compatible 10-bit Analog-to-Digital Converter (A/D) Module................................................................................................... 181
18.0 Low Voltage Detect .................................................................................................................................................................. 189
19.0 Special Features of the CPU .................................................................................................................................................... 195
20.0 Instruction Set Summary .......................................................................................................................................................... 211
21.0 Development Support............................................................................................................................................................... 253
22.0 Electrical Characteristics .......................................................................................................................................................... 259
23.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 289
24.0 Packaging Information.............................................................................................................................................................. 305
Appendix A: Revision History ............................................................................................................................................................ 313
Appendix B: Device Differences........................................................................................................................................................ 313
Appendix C: Conversion Considerations........................................................................................................................................... 314
Appendix D: Migration from Baseline to Enhanced Devices ............................................................................................................. 314
Appendix E: Migration from Mid-range to Enhanced Devices........................................................................................................... 315
Appendix F: Migration from High-end to Enhanced Devices ............................................................................................................ 315
Index .................................................................................................................................................................................................. 317
On-Line Support................................................................................................................................................................................. 327
Reader Response .............................................................................................................................................................................. 328
PIC18FXX2 Product Identification System......................................................................................................................................... 329
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